SCOPUS 정보 검색 플랫폼

Quality and Reliability Engineering International

Volumn 6, Issue 4, 1990, Pages 275-284

Temperature dependence of microelectronic device failures

(3) Pecht, Michael a Lall, Pradeep a Whelan, Stanley J b

a UNIVERSITY OF MARYLAND (United States)

b WESTINGHOUSE ELECTRIC COMPANY (United States)

Author keywords

Arrhenius; Corrosion; Die Metallization; Dielectric failure; Electrical overstress; Electromigration; Electrostatic discharge; Eyring; Fatigue; Flexure; Fracture; Hot electrons Surface charge; Metallization migration; Oxide breakdown; Passivation layer; Rate of temperature change; Slow trapping; Temperature gradients; Wire bonds

Indexed keywords

FAILURE ANALYSIS; MICROELECTRONICS - RELIABILITY;

ARRHENIUS FUNCTIONS; EYRING FUNCTIONS; PREDICTION MODELS; TEMPERATURE DEPENDENCE;

SEMICONDUCTOR DEVICES;

EID: 0025493386 PISSN: 07488017 EISSN: 10991638 Source Type: Journal
DOI: 10.1002/qre.4680060410 Document Type: Article

Times cited : (12)

References (55)

1
- 84990632577
- Correspondence with Dave Taylor of Power Products Division, 29 September
- (1989)

2
- 84990709815
- Summary Chart of 1984/1987 Failure Analysis Memos, Westinghouse Electric Corp.
- (1989)

3
- 84990632590
- ‘Analysis of aeronautical equipment environmental failures’, May 1971. AFFDL‐TR‐71‐32.
- Dantowitz, A.¹ Hirschberger, G.² Pravidho, D.³

4
- 84910916011
- Internal lead fatigue through thermal expansion in semiconductor devices
- (1968) IEEE Transactions on Electron Devices , vol.15 ED , pp. 617
- Gaffeny, J.¹

5
- 84990655044
- ‘A failure prediction model for wire bonds’, Proc. of the 1989 Intl. Symp. on Hyb. Micro.
- (1989) , pp. 607-613
- Pecht, M.¹ Lall, P.² Dasgupta, A.³

6
- 85041976505
- ‘On measuring the mechanical properties of aluminum metallization and their relationship to reliability problems’, 11th Annual Proceedings of Reliability Physics Symposium
- (1973) , pp. 33-40
- Philosky, E.M.¹ Ravi, K.V.²

7
- 84965442974
- Van Nostrand and Reinhold, New York
- (1989) Microelectronics Packaging Handbook
- Tummala, R.R.¹ Rymaszewski, E.J.²

8
- 84990722179
- ‘Stress driven diffusive voiding of aluminum conductor lines: a model for time dependent failure’, Sandia National Laboratories, Report SAND 88‐09 46, NTIS DE 89‐0010507
- (1988)
- Yost, F.G.¹ Romig, A.D.² Bourcier, R.J.³

9
- 0020199542
- Effects of several parameters on corrosion rates of Al conductors in integrated circuits
- (1982) J. Electrochemical Society, Solid State Science and Technology , vol.129 , Issue.10 , pp. 2270
- Lerner, I.¹ Elpride, J.M.²

10
- 84990669823
- ‘Corrosion of aluminum IC metallization with defective surface passivation layer’, 18th Ann. Proc. Rel. Phys. Symp.
- (1980) , pp. 282
- Commizolli, R.B.¹ White, L.K.² Kern, W.³ Schnable, G.R.⁴

11
- 84990694618
- ‘Moisture induced aluminum corrosion and stress on the chip in plastic encapsulated LSI's’, Proc. 17th Rel. Phys. Symp.
- (1979) , pp. 113-117
- Inayoski, H.¹ Nishi, K.² Okibawa, S.³ Wabashima, Y.⁴

12
- 84990694639
- ‘Reliability evaluation of trimetal integrated circuits in plastic packages’, 15th Ann. Rel. Phy. Symp.
- (1977) , pp. 244-249
- Khajezadah, H.¹ Rose, A.S.²

13
- 0018721718
- ‘Influence of plastic encapsulants and passivation layers on corrosion of thin Al films subjected to humidity stress’, Proc. 17th Ann. Rel. Phys. Symp.
- (1979) , pp. 103-112
- Sim, S.P.¹ Lawson, R.W.²

14
- 0014634929
- Encapsulation of integrated circuits
- (1969) Proceedings of the IEEE , vol.57 , pp. 1610
- White, M.L.¹

15
- 84937744175
- Aluminum metallization—advantages and limitations for integrated circuit applications
- (1969) Proceedings of the IEEE , vol.57 , pp. 1570
- Schnabble, G.L.¹ Keen, R.S.²

16
- 0023166987
- A review of corrosion failure mechanisms during accelerated tests
- (1987) J. Electrochem. Soc. , vol.134 , Issue.1 , pp. 175-190
- Steppan, J.J.¹ Roth, J.A.² Hall, L.C.³

17
- 0018054143
- An electrical overstress failure model for bipolar semiconductor components
- (1978) IEEE Trans. Comp. Hybrids. and Manf. Technology , vol.1 CHMT , pp. 345-353
- Alexander, D.R.¹

18
- 0019699382
- Reliability problems in TTL‐LS devices
- (1981) Microelec & Rel. , vol.21 , pp. 637-651
- Canali, C.¹ Fatini, F.² Gaviraghi, S.³ Senin, A.⁴

19
- 0017925201
- ‘Electrical overstress failure analysis in microcircuits’, 16th Annual Proceedings International Rel. Phy. Symp.
- (1978) , pp. 41-46
- Smith, J.S.¹

20
- 0004074930
- McGraw Hill, New York
- (1965) Silicon Semiconductor Technology
- Runayan, W.R.¹

21
- 0017905137
- CMOS/SOS gate protection networks
- (1978) IEEE Trans. Electronic Devices , vol.25 ED , Issue.8 , pp. 917-925
- Pancholy, R.K.¹ Jhnoki²

22
- 0020848561
- Facing the headache of early failures: state of the art review of burn‐in decisions
- 1266
- (1983) Proc. IEEE , vol.71 , pp. 1257
- Kuo, W.¹ Kuo, Y.²

23
- 0019261125
- ‘Reliability influences from electrical overstress on LSI devices’, 18th Ann. Proc. Int. Rel. Phy. Symp.
- (1980) , pp. 190-196
- Hart, A.¹ Teng, T.T.² McKenna, A.³

24
- 0019709403
- ‘Temperature dependent defect level for an ionic failure mechanism’, 19th Ann. Proc. Int. Rel. Phys. Symp.
- (1981) , pp. 172-174
- Hemmert, R.S.¹

25
- 0019487980
- Recoverable ionic contaminant induced failures on N‐channel memory products
- (1981) Microelec. and Rel. , vol.21 , pp. 63-77
- Hemmert, R.S.¹

26
- 84990729118
- ‘Recovery characteristics of ionic drift induced failures under time/temperature stress’, 18th Ann. Proc. Int. Rel. Phy. Symp.
- (1980) , pp. 217-219
- Bell, J.J.¹

27
- 84990670279
- ‘Modeling the temperature dependence of integrated circuit failures’, Thermal Management Concepts in Microelectronic Packaging, International Society of Hybrid Microelectronics, 1984, pp.
- Wager, A.J.¹ Cook, H.C.²

28
- 0020115557
- Testing for MOS IC failure modes
- (1982) IEEE Trans. Rel. , vol.31 R , pp. 9-17
- Edwards, D.G.¹

29
- 0019208250
- Temperature dependence of component failure rate
- (1980) Microelec. and Rel. , vol.20 , pp. 219-246
- Blanks, H.S.¹

30
- 0020936675
- Failure physics of integrated circuits (a review)
- (1983) Microelectronics Reliability , vol.23 , pp. 609-707
- Stojadinovic, N.D.¹

31
- 84990632922
- ‘Interface instabilities’, 12th Ann. Proc. Int. Rel. Phy. Symp.
- (1974) , pp. 267-272
- Nicollian, E.H.¹

32
- 84990663887
- EPROM reliability: Parts I and II
- (1980) Electronics , vol.53 , pp. 133-141
- Woods, M.H.¹ Rossenburg, S.²

33
- 0018457253
- 1 μm MOSFET VLSI technology Part IV: hot electrons design constraints
- (1979) IEEE Transactions on Electron Devices , vol.26 ED , Issue.4 , pp. 346-353
- Ning, T.H.¹ Cook, P.W.² Demmeral, R.N.³ Osburn, G.M.⁴ Schuster, S.S.⁵ Yin, H.N.⁶

34
- 0019606794
- Effect of long term stress on IGFET degradations due to hot electron trapping
- (1981) IEEE Transactions on Electron Devices , vol.28 ED , Issue.8 , pp. 923
- Matsumoto, H.¹

35
- 84990679163
- ‘Electromigration, thermal analysis and die attach—a case history’, 20th Ann, Proc. Int. Rel. Phy. Symp.
- (1982) , pp. 34-44
- Patridge, J.¹ Marques, A.² Camp, R.³

36
- 84990729145
- ‘Failure of small thin film conductors due to high current density pulses’, 16th Ann. Proc. Int. Rel. Phy. Symp.
- (1978) , pp. 248-254
- Kinsborn, E.¹ Smith, C.M.² English, A.T.³ Cynoweth, T.⁴

37
- 84990739214
- ‘Theory of the failure of semiconductor contacts by electromigration’, 8th Ann. Proc. Rel. Phys. Symp.
- (1970) , pp. 116-120
- Oliver, C.B.¹ Bower, D.E.²

38
- 51249172628
- Electromigration in the presence of a temperature gradient: experimental study and modelling
- (1988) Journal of Electronic Materials , vol.17 , pp. 473-478
- Schawarzenberger, A.P.¹ Ross, C.A.² Evetts, J.E.³ Greer, A.L.⁴

39
- 70349962626
- Analysis of chemical and metallurgical change in microcircuit metallization systems
- (1969) IEEE Transactions on Electron Devices , vol.16 ED , pp. 351
- Bart, J.J.¹

40
- 0014752740
- Aluminum metallization and contacts for integrated circuits
- (1970) Met. Trans , vol.713
- Lane, C.H.¹

41
- 0020250303
- Caution‐electrostatic discharge at work
- (1982) IEEE Trans. Comp. Hyb. and Man. Tech. , vol.5 CHMT , pp. 512-515
- Moss, R.Y.¹

42
- 84990722621
- ‘Application of electronic overstress models to gate protective networks’, IEEE Proceedings—Reliability Physics
- (1978) , pp. 47-55
- Wunch, D.C.¹

43
- 0003583688
- Oxford University Press, London
- (1959) Conduction of Heat in Solids , pp. 255-263
- Carslaw, H.S.¹ Jaeger, J.C.²

44
- 49949124708
- Failure modes of integrated circuits and their relationship to reliability
- (1968) Micro. & Rel. , vol.7 , pp. 257-264
- Workman, W.¹

45
- 0015331235
- The failure physics approach to IC reliability
- (1972) Micro. & Rel. , vol.11 , pp. 151-157
- Farrow, R.H.¹ Parker, G.W.²

46
- 0016657241
- Stress corrosion of low temperature solder glass
- (1975) Noncrystalline Solids , vol.19 , Issue.1 , pp. 263-272
- Tummala, R.R.¹

47
- 0020764471
- Comparison of characteristics of N‐channel and P‐channel MOSFETs for VLSI
- (1983) IEEE Transactions on Electron Devices , vol.30 ED , Issue.6 , pp. 675-680
- Takeda, E.¹ Nakagome, Y.² Kume, H.³ Suzuki, N.⁴ Asai, S.⁵

48
- 0003389519
- Cooling electronic equipment: past, present, and future
- Int. Center for Heat Transfer, Dubrovnik, Yugoslavia, Hemisphere Publishing Co., 29 August‐2 September
- (1988) Proc. International Symposium on Heat Transfer in Electronic and Microelectronic Equipment
- Nakayama, W.¹ Bergles, A.E.²

49
- 84990632950
- ‘Evolution of cooling technology in medium and large scale computers—an IBM perspective’, Proc. International Symposium on Heat Transfer in Electronic and Microelectronic Equipment, Int. Center for Heat Transfer, Dubrovnik, Yugoslavia, Hemisphere Publishing Co, 29 August‐2 September
- (1988)
- Chu, R.C.¹ Simons, R.E.²

50
- 84990662079
- ‘Thermal control for mini‐ and microcomputers: the limits of air cooling’, Proc. International Symposium on Heat Transfer in Electronic and Microelectronic Equipment, Int. Center for Heat Transfer, Dubrovnik, Yugoslavia, Hemisphere Publishing Co., 29 August‐2 September
- (1988)
- Hannemann, R.¹

51
- 0042116126
- Reliability and degradation of silicon devices and integrated circuits
- M. J. Howes, D. V. Morgan, (eds), Wiley‐Interscience
- (1981) Reliability and Degradation: Semiconductor Devices and Circuits
- Wood, J.¹

52
- 0004000629
- Longman Scientific and Technical Publishing Co., Burnt Mill, Harlow, Essex CM20 2JE, U. K
- Reliability Evaluation of Engineering Systems: Concepts and Techniques
- Billington, R.¹ Allen, R.N.²

53
- 0019149452
- Thermal resistance: a reliability consideration
- (1980) IEEE Trans. Components, Hybrids and Manufacturing Technology , vol.3 CHMT , Issue.4 , pp. 580-587
- Manchester, K.E.¹ Bird, D.W.²

54
- 84933011562
- Intercrystalline cracking in creep of some aluminum alloys
- (1956) J. Inst. Metals , vol.85 , pp. 480-488
- Nield, B.J.¹ Quarrel, A.G.²

55
- 84990662077
- ‘Statistical modeling of silicon dioxide reliability’, 26th Ann. Proc. Rel. Phys.
- (1988) , pp. 131-138
- Lee, J.¹ Chin, I.C.² Hu, C.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.