Electromigration and mechanical stress in aluminium conductor tracks passivated by anodisation

Journal of Electronic Materials

Volumn 19, Issue 9, 1990, Pages 911-918

  Ross, C A ^a   Drewery, J S ^a   Somekh, R E ^a   Evetts, J E ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Al; electromigration; mechanical stress

Indexed keywords

ALUMINUM AND ALLOYS--ANODIC OXIDATION; ELECTRIC CONDUCTORS;

ELECTROMIGRATION; PASSIVATION;

INTEGRATED CIRCUITS;

EID: 0025488308     PISSN: 03615235     EISSN: 1543186X     Source Type: Journal    
DOI: 10.1007/BF02652916     Document Type: Article

References (30)

1. Autodiffusion au joint de grains de bicristaux d'argent soumis à une pression hydrostatique
2. The effect of passivation thickness on the electromigration lifetime of Al/Cu thin film conductors
3. A Critical Evaluation of Indentation Techniques for Measuring Fracture Toughness: I, Direct Crack Measurements
4. Thermal Cycling and Surface Reconstruction in Aluminum Thin Films
5. Voids in thin as-deposited gold films prepared by vapor deposition