Formation mechanism of liquid phase by reaction diffusion during diffusion bonding

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society

Volumn 8, Issue 3, 1990, Pages 336-342

  Nishiguchi, Kimiyuki ^a   Takahashi, Yasuo ^a   Seo, Atsushi ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Bonding mechanism; Copper; Liquid phase diffusion bonding; Oxide film; Reaction diffusion; Silver

Indexed keywords

BONDING--DIFFUSION; SILVER AND ALLOYS--BONDING;

DIFFUSION BONDING;

COPPER AND ALLOYS;

EID: 0025477804     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.8.336     Document Type: Article

References (3)

1. G. V. Kidoson : Some Aspects of The Growth of Diffusion Layers in Binary Systems, J. Nuclear Mater., 3, (1961) 21.
2. J. R. Cahoon and W. V. Youdelis : The Diffusion of Copper in Silver-Copper alloys, Trans. Metall. Soc. AIME, 239, (1967) 127.
3. J. Unnam and C. R. Houska : An X-ray Study of Diffusion in The Cu-Ag system, J. Applied Phys., 47, (1976) 4336.