Leaky lamb waves for the ultrasonic nondestructive evaluation of adhesive bonds

Journal of Engineering Materials and Technology, Transactions of the ASME

Volumn 112, Issue 3, 1990, Pages 255-259

  Mai, Ajit K ^a   Xu, Pei Cheng ^a   Bar Cohen, Yoseph ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING--INTERFACES; ELASTICITY; NONDESTRUCTIVE EXAMINATION--ULTRASONIC APPLICATIONS;

ADHESIVE BONDS; BONDED ALUMINUM PLATES; BONDED PLATE DISPERSION CURVES; LEAKY LAMB WAVE (LLW) TECHNIQUES;

ADHESIVES;

EID: 0025464777     PISSN: 00944289     EISSN: 15288889     Source Type: Journal    
DOI: 10.1115/1.2903319     Document Type: Article

References (16)

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