Effect of thermomechanical coupling on the response of elastic solids

AIAA Journal

Volumn 28, Issue 7, 1990, Pages 1319-1322

  Amin, A M ^a   Sierakowski, R L ^a  

^a OHIO STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MATHEMATICAL TECHNIQUES - EIGENVALUES AND EIGENFUNCTIONS; STRESSES - ANALYSIS;

COUPLED THERMOELASTICITY THEORY;

BEAMS AND GIRDERS;

EID: 0025460825     PISSN: 00011452     EISSN: None     Source Type: Journal    
DOI: 10.2514/3.25215     Document Type: Article

References (9)

1. Mindlin, R. D., and Goodman, L. D., “Beam Vibrations with Time-Dependent Boundary Conditions,” Journal of Applied Mechanics, Vol. 17, Dec. 1950, pp. 377-380.
2. Boley, B. A., and Weiner, J. H., Theory of Thermal Stresses, John Wiley, New York, 1960.
3. Soler, A. I., and Brull, M. A., “On the Solution to Transient Coupled Thermoelastic Problems by Perturbation Techniques,” Journal of Applied Mechanics, Vol. 32, June 1965, pp. 389-399.
4. Bahar, L. Y., and Hetnarski, R. B., “Coupled Thermoelasticity of a Layered Medium,” Journal of Thermal Stresses, Vol. 3, April 1980, pp. 141-152.
5. Takeuti, Y. and Tsuji, M., “Thermal Stress Problems in Industry, Part 6: Transient Thermal Stresses in a Plate due to Rolling with Considerations of Coupling Effect,” Journal of Thermal Stresses, Vol. 5, Jan. 1982, pp. 53-65.
6. Takeuti, Y., and Furkawa, T., “Some Considerations on Thermal Shock Problems in a Plate,” Journal of Applied Mechanics, Vol. 48, March 1981, pp. 113-118.
7. Takeuti, Y., and Furkawa, T., “Some Considerations on Thermal Shock Problems in a Plate,” Journal of Thermal Stresses, Vol. 4, 1981, pp. 461-478.
8. Chen, Y., Ghoneim, H., and Chen, Yu, “A Finite Element Solution of the Coupled Thermoelasticity Equations in A Slab,” Advances in Computer Technology, ASME, Vol. 2, 1980, pp. 199-218.
9. Li, Y. Y., Ghoneim, H., and Chen, Y., “A Numerical Method in Solving a Coupled Thermoelasticity Equation and Some Results,” Journal of Thermal Stresses, Vol. 6, April 1983, pp. 253-280.