A Novel Lossy and Dispersive Interconnect Model for Integrated Circuit Simulation

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 13, Issue 2, 1990, Pages 275-280

  Yuan, Jiann Shiun ^a   Eisenstadt, William R ^b   Liou, Juin J ^c  

^a TEXAS INSTRUMENTS   (United States)

^b UNIVERSITY OF FLORIDA   (United States)

^c UNIVERSITY OF CENTRAL FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC NETWORKS, NONLINEAR; SUBSTRATES;

IC INTERCONNECT MODEL; METAL INTERCONNECT SIGNAL TRANSMISSION; SIGNAL ATTENUATION; SILICON SUBSTRATES; SPICE SIMULATION; TRANSIENT WAVEFORM PROPAGATION;

INTEGRATED CIRCUITS;

EID: 0025448921     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.56157     Document Type: Article

References (12)

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