A Pillar-Shaped Via Structure in a Cu-Polyimide Multilayer Substrate

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 13, Issue 2, 1990, Pages 440-443

  Iwasaki, Noboru ^a   Yamaguchi, Satoru ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; LITHOGRAPHY--PHOTOLITHOGRAPHY; PLASTICS LAMINATES; SUBSTRATES--FABRICATION;

COPPER CONDUCTOR FORMATION; MULTILAYER SUBSTRATE; PATTERN ELECTROPLATING; PILLAR-SHAPED VIA STRUCTURE; POSITIVE PHOTORESIST;

INTEGRATED CIRCUITS, LSI;

EID: 0025445468     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.56181     Document Type: Article

References (12)

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