Novel approach for reducing the area occupied by contact pads on process control chips

Volumn , Issue , 1990, Pages 75-80

  Walton, A J ^a   Gammie, W ^a   Morrow, D ^a   Stevenson, J T M ^a   Holwill, R J ^a  

^a UNIVERSITY OF EDINBURGH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT TESTING; PROCESS CONTROL; TRANSISTORS;

CONTACT PADS; CONTINUITY TESTS; ELECTRICAL VERNIERS; YIELD MONITORING;

INTEGRATED CIRCUIT TESTING;

EID: 0025235223     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)