Thermal characteristic study of extruded-type heat sinks in considering air flow bypass phenomenon

Proceedings - IEEE Semiconductor Thermal and Temperature Measurement Symposium

Volumn , Issue , 1990, Pages 95-102

  Lee, Rong S ^a   Huang, Hsin C ^a   Chen, Wun Y ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AIR--COOLANTS; FLOW OF FLUIDS; HEAT SINKS--COOLANTS;

AIR COOLING HEAT SINKS; AIR FLOW BYPASS; EXTRUDED-TYPE HEAT SINKS; NUSSELT NUMBER; PCB (PRINTED CIRCUIT BOARD); REYNOLDS NUMBER;

ELECTRONICS PACKAGING;

EID: 0025218183     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)