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Volumn , Issue , 1989, Pages 107-112
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Hot air leveled tin: Solderability and some related properties
a
a
AMP Inc
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER AND ALLOYS--SOLDERING;
INTERMETALLICS;
SOLDERS--ELECTRIC PROPERTIES;
COPPER ALLOY SUBSTRATES;
HOT AIR LEVELED TIN;
INTERMETALLIC GROWTH;
SOLDERABILITY;
WHISKER GROWTH;
WHISKERING;
TIN AND ALLOYS;
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EID: 0024946612
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (7)
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References (9)
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