Impingement cooling of a simulated electronics package with a square array of round air jets

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 111, Issue , 1989, Pages 107-112

  Hamadah, T T ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC CIRCUITS--HEAT TRANSFER; FLOW OF FLUIDS--JETS; HEAT TRANSFER--CONVECTION; MICROELECTRONICS--COOLING;

AIR JET IMPINGEMENT COOLING; HEAT TRANSFER COEFFICIENTS;

ELECTRONIC EQUIPMENT;

EID: 0024940238     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)