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Volumn , Issue , 1989, Pages 103-104
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Selective chemical vapor deposition of copper
a a
a
NTT CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER AND ALLOYS--THIN FILMS;
SEMICONDUCTOR DEVICE MANUFACTURE;
DOUBLE-LEVEL INTERCONNECTIONS;
METAL SILICIDE;
VIA HOLES;
SEMICONDUCTOR MATERIALS;
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EID: 0024901457
PISSN: 07431562
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (52)
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References (4)
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