Tape on substrate, a new systems approach for manufacturing multilayer hybrid circuits

Volumn , Issue , 1989, Pages 147-151

  Patterson, F K ^a   Gantzhorn, J E ^a   Daly, T P ^a   Rellick, J R ^a   Iwabuchi, M ^a   Kawasaki, S ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; SOLID STATE DEVICES, THICK FILM--MANUFACTURE;

ALUMINA SUBSTRATES; MATERIALS SYSTEM; MULTILAYER HYBRID CIRCUITS; PROCESS STEPS; THICK-FILM HYBRID CIRCUIT;

INTEGRATED CIRCUITS, HYBRID;

EID: 0024891807     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)