Computer Simulation of Materials Processing Plasma Discharges

Critical Reviews in Solid State and Materials Sciences

Volumn 16, Issue 1, 1989, Pages 1-35

  Kline, Larry E ^a   Kushner, Mark J ^b  

^a WESTINGHOUSE ELECTRIC COMPANY   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION - APPLICATIONS; ETCHING - PLASMA JET; FILMS - CHEMICAL VAPOR DEPOSITION; PHOTORESISTS - CHEMICAL VAPOR DEPOSITION; PLASMAS - APPLICATIONS;

COMPUTER SIMULATION PROGRAMS; FIRST PRINCIPLES MODELS; MATERIALS PROCESSING PLASMA DISCHARGES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING; PROCESS MODELING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0024879422     PISSN: 10408436     EISSN: 15476561     Source Type: Journal    
DOI: 10.1080/10408438908244626     Document Type: Article

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