Electromigration interconnect lifetime under AC and pulse DC stress

Volumn , Issue , 1989, Pages 215-219

  Liew, B K ^a   Cheung, N W ^a   Hu, C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM AND ALLOYS--THIN FILMS;

AC STRESS LIFETIMES; DC STRESS LIFETIME; ELECTROMIGRATION LIFETIME; INTERCONNECT LIFETIME; VACANCY RELAXATION MODEL;

INTEGRATED CIRCUITS;

EID: 0024868561     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/irps.1989.363389     Document Type: Conference Paper

References (9)