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Volumn 36, Issue 11, 1989, Pages 2462-2465

Temperature Acceleration of Time-Dependent Dielectric Breakdown

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS--THERMAL EFFECTS; SEMICONDUCTOR DEVICES--ELECTRIC BREAKDOWN;

EID: 0024766460     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/16.43668     Document Type: Article
Times cited : (114)

References (14)
  • 1
    • 0021640143 scopus 로고
    • Reliability in MOS integrated circuits
    • M.H. Woods, and B.L. Euzent, “Reliability in MOS integrated circuits,” in IEDM Tech. Dig., 1984, p. 50.
    • (1984) IEDM Tech. Dig. , pp. 50
    • Woods, M.H.1    Euzent, B.L.2
  • 2
    • 0018727292 scopus 로고
    • Method of determining reliability screens for time dependent dielectric breakdown
    • D.L. Crook, “Method of determining reliability screens for time dependent dielectric breakdown,” in Proc. Int. Reliability Phys. Symp., 1979, p. 1.
    • (1979) Proc. Int. Reliability Phys. Symp. , pp. 1
    • Crook, D.L.1
  • 3
    • 0023348332 scopus 로고
    • Reliability of CMOS ICs with gate oxide shorts
    • May
    • J.M. Soden and C.F. Hawkins, “Reliability of CMOS ICs with gate oxide shorts,” Semiconductor Int., p. 240, May 1987.
    • (1987) Semiconductor Int. , pp. 240
    • Soden, J.M.1    Hawkins, C.F.2
  • 4
    • 0021292083 scopus 로고
    • Predicting oxide failure rates using the matrix of a 64K DRAM chip
    • D. Wendell, D. Segers, and B. Wang, “Predicting oxide failure rates using the matrix of a 64K DRAM chip,” in Proc. Int. Reliability Phys. Symp., 1984, p. 113.
    • (1984) Proc. Int. Reliability Phys. Symp. , pp. 113
    • Wendell, D.1    Segers, D.2    Wang, B.3
  • 5
    • 0021305050 scopus 로고
    • Characteristics and reliability of 100 A oxides
    • D.A. Baglee, “Characteristics and reliability of 100 A oxides,” in Proc. Int. Reliability Phys. Symp., 1984, p. 152.
    • (1984) Proc. Int. Reliability Phys. Symp. , pp. 152
    • Baglee, D.A.1
  • 7
    • 0023386518 scopus 로고
    • 2 films thermally grown on a heavily doped Si substrate-characterization and modeling
    • July
    • 2 films thermally grown on a heavily doped Si substrate-characterization and modeling,” IEEE Trans. Electron Devices, vol. ED-34, 1540, July 1987.
    • (1987) IEEE Trans. Electron Devices , vol.ED-34 , pp. 1540
    • Chen, C.F.1    Wu, C.Y.2    Lee, M.K.3    Chen, C.N.4
  • 9
    • 0024138078 scopus 로고
    • Oxide breakdown wearout limitation on thermally grown thin gate oxide
    • Y. Hokari, “Oxide breakdown wearout limitation on thermally grown thin gate oxide,” in Tech. Dig. Symp. VLSI Technol., 1988, p. 41.
    • (1988) Tech. Dig. Symp. VLSI Technol. , pp. 41
    • Hokari, Y.1
  • 10
    • 84941504025 scopus 로고
    • Electrical breakdown in thin gate and tunneling oxides
    • Feb.
    • I.C. Chen, S.E. Holland, and C. Hu, “Electrical breakdown in thin gate and tunneling oxides,” IEEE Trans. Electron Devices, vol. ED-32, p. 413, Feb. 1985.
    • (1985) IEEE Trans. Electron Devices , vol.ED-32 , pp. 413
    • Chen, I.C.1    Holland, S.E.2    Hu, C.3
  • 11
    • 0024170331 scopus 로고
    • Projecting the minimum acceptable oxide thickness for time-dependent dielectric break-down
    • R. Moazzami, J. Lee, I.C. Chen, and C. Hu, “Projecting the minimum acceptable oxide thickness for time-dependent dielectric break-down,” in IEDM Tech. Dig., 1988, p. 710.
    • (1988) IEDM Tech. Dig. , pp. 710
    • Moazzami, R.1    Lee, J.2    Chen, I.C.3    Hu, C.4
  • 12
    • 0024122432 scopus 로고
    • Modeling and characterization of gate oxide reliability
    • Dec.
    • J. Lee, I.C. Chen, and C. Hu, “Modeling and characterization of gate oxide reliability,” IEEE Trans. Electron Devices., vol. 35, p. 2268, Dec. 1988.
    • (1988) IEEE Trans. Electron Devices. , vol.35 , pp. 2268
    • Lee, J.1    Chen, I.C.2    Hu, C.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.