Characteristics of adhesion between photoresist and inorganic substrate

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 28, Issue 10, 1989, Pages 2137-2141

  Nagata, Hitoshi ^a   Kawai, Akira ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

Adhesion; Contact angle; Dynamic memory; Intrusion; Photoresist; Semiconduc tor; Surface tension

Indexed keywords

INORGANIC COMPOUNDS; INTEGRATED CIRCUITS, LSI; SUBSTRATES;

DYNAMIC MEMORY; TENSILE STRENGTH;

PHOTORESISTS;

EID: 0024754273     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.28.2137     Document Type: Article

References (9)

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