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Volumn 36, Issue 6, 1989, Pages 1171-1174

The Influence of Boundary Locations on Wiring Capacitance Simulation

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION;

EID: 0024682064     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/16.24364     Document Type: Article
Times cited : (1)

References (9)
  • 1
    • 0024091883 scopus 로고
    • The impact of data-line interference noise on DRAM scaling
    • Y. Nakagome, et al., “The impact of data-line interference noise on DRAM scaling,” IEEEJ. Solid-State Circuits, vol. 23, pp. 1120-1 127, 1988.
    • (1988) IEEE J. Solid-State Circuits , vol.23 , pp. 1120-1127
    • Nakagome, Y.1
  • 2
    • 0019603042 scopus 로고
    • Coupling capacitances for two-dimensional wires
    • R. L. M. Dang and N. Shigyo, “Coupling capacitances for two-dimensional wires,” IEEE Electron Device Lett., vol. EDL-2, pp. 196-197, 1981.
    • (1981) IEEE Electron Device Lett , vol.EDL-2 , pp. 196-197
    • Dang, R.L.M.1    Shigyo, N.2
  • 3
    • 0021551638 scopus 로고
    • Computation of wire and junction capacitance in VLSI structures
    • F. Straker and S. Selberherr, “Computation of wire and junction capacitance in VLSI structures,” in Proc. V-MIC Conf., 1984, pp. 209-217.
    • (1984) Proc. V-MIC Conf , pp. 209-217
    • Straker, F.1    Selberherr, S.2
  • 5
    • 0022562809 scopus 로고
    • Process-based three-dimensional capacitance simulation—TRICEPS
    • T. Toyabe, S. Ikenaga, M. Aoki, H. Masuda, and K. Itoh, “Memory cell capacitance simulation in three-dimensions,” in Proc. VLSI Symp., 1988, pp. 27–28.
    • (1986) IEEE Trans. Computer-Aided Design , vol.CAD-5 , pp. 215-220
    • Uebbing, R.H.1    Fukuma, M.2
  • 6
    • 0024136669 scopus 로고
    • Memory cell capacitance simulation in three-dimensions
    • A. Seidl, H. Klose, M. Svoboda, J. Oberndorfer and W. Rosner, “CAPCAL—A 3-D capacitance solver for support of CAD systems,” IEEE Trans. Computer-Aided Design, vol. CAD-5, pp. 549–556, 1986.
    • (1988) Proc. VLSI Symp , pp. 27-28
    • Toyabe, T.1    Ikenaga, S.2    Aoki, M.3    Masuda, H.4    Itoh, K.5
  • 8
    • 0024171624 scopus 로고
    • A three-level wiring capacitance analysis for VLSIs using three-dimensional simulator
    • T. Shibata et al., “Capacitance modeling and measurements of fine-patterned interconnects,” in Abstracts ECS Spring Meeting, 1981, pp. 677–678.
    • (1988) IEDM Tech. Dig , pp. 340-343
    • Ushiku, Y.1    Ono, H.2    Shigyo, N.3
  • 9
    • 0024091883 scopus 로고
    • Capacitance modeling and measurements of fine-patterned interconnects
    • Y. Nakagome et al., “The impact of data-line interference noise on DRAM scaling,” IEEEJ. Solid-State Circuits, vol. 23, pp. 1120–1127, 1988.
    • (1981) Abstracts ECS Spring Meeting , pp. 677-678
    • Shibata, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.