Radio-frequency sputter deposition of boron nitride based thin films

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 7, Issue 4, 1989, Pages 2646-2651

  Mitterer, C ^a   Rodhammer P ^a   Stori H ^b   Jeglitsch, F ^c  

^a Metallwerk Plansee Gmbh ^*  (Australia)

^b VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^c Institut fur Metallkunde und Werkstoffprufung   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

BORON; FILMS; SPUTTERING; SURFACE TREATMENT;

EID: 0024583333     PISSN: 07342101     EISSN: 15208559     Source Type: Journal    
DOI: 10.1116/1.575767     Document Type: Article

References (24)

1. P. Daniel, “Ultrahard Materials Applications Technology,” Vol. 1, De Beers Industrial Diamond Division, Charters, 1982.
2. K.H. Seidel, B. Goranchev, K. Reichelt, W. Schaal, and H. Dimigen, in Proceedings of the Ion and Plasma Assisted Techniques, Brighton (CEP Consultants Ltd., Edinburgh, 1987), p. 222.
3. Y. Doi, Sumitomo Electric Industries, Ltd., Japan Patent Laid Open No. 59–80775 (1 November 1982).
4. M.D. Wiggins and C.R. Aita, J. Vac. Sci. Technol. A 2, 322 (1984).
5. B. Rother and C. Weissmantel, Phys. Status Solidi A 87, K119 (1985).
6. l. Thin Solid Films 72, 19 (1980).
7. C. Weissmantel, J. Vac. Sci. Technol. 18, 179 (1981).
8. B. Rother, H.D. Zscheile, C. Weissmantel, C. Heiser, G. Holzhüter et al., Thin Solid Films 142, 83 (1986).
9. H.A. Beale, Ind. Res. Dev. 1979 (June), 143.
10. l0H.A. Beale, Applied Coatings International, Inc., U.S. Patent No. 4 412 899 (1 November 1983).
11. UH.A. Beale, Applied Coatings International, Inc., U.S. Patent No. 4 415 420 (15 November 1983).
12. , 2S. Shanfield and R. Wolfson, J. Vac. Sci. Technol. A 2, 323 (1983).
13. , 3K.L. Chopra, V. Agarwal, V.D. Vankar, C.V. Deshpandey, and R.F. Bunshah, Thin Solid Films 126, 307 (1985).
14. !4K. Fuchs, P. Rödhammer, E. Bertel, F.P. Netzer, and E. Gornik, Thin Solid Films 151, 383 (1987).
15. L.E. Davis, N.C. MacDonald, D.W. Palmberg, G.E. Riach, and R.E. Weber, Handbook of Auger Electron Spectroscopy (Physical Electronics, Eden Prairie, MN, 1976).
16. J. Laimer, P. Braun, H. Störi, F. Viehböck, P. Rödhammer, and K. Kailer, Mikrochim. Acta 10, 177 (1983).
17. l7J.D. Wilcock and D.S. Campbell, Thin Solid Films 12, 17 (1972).
18. K. Ploog, H. Schmidt, E. Amberger, G. Will, and K.H. Kossobutzki, J. Less-Common Met. 29, 161 (1972).
19. l9Gmelin Handbuch der anorganischen Chemie, Borverbindungen (Springer, Berlin, 1974), Vol. 1.
20. J.L. Peytavy, A. Lebugle, G. Montel, and H. Pastor, High Temp. High Pressures 10, 341 (1978).
21. lH. Holleck, Binäre und ternäre Carbid- und Nitridsysteme der Übergangs-metalle (Gebrüder Borntraeger, Berlin, 1984).
22. H. Nowotny, F. Benesovsky, C. Brukl, and O. Schob, Mh. Chem. 92, 403 (1961).
23. W.D. Münz, J. Vac. Sci. Technol. A 6, 2717 (1986).
24. Gmelin Handbuch der anorganischen Chemie, Aluminium, Teil B, Die Verbindungen des Aluminiums (Chemie, Berlin, 1934).