Magnetic field effects on the electrodeposition of copper from copper sulphate in sulphuric acid

Surface and Coatings Technology

Volumn 34, Issue 4, 1988, Pages 455-462

  Chiba, A ^a   Ogawa, T ^a   Yamashita, T ^b  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

^b KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS - X-RAY ANALYSIS; COPPER COMPOUNDS; COPPER PLATING; CRYSTALS - ORIENTATION; ELECTRODEPOSITION - MAGNETIC FIELD EFFECTS;

ANODIC DISSOLUTION; MAGNETIC FLUX DENSITIES; TEXTURE COEFFICIENTS;

COPPER AND ALLOYS;

EID: 0024280667     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/0257-8972(88)90100-4     Document Type: Article

References (17)

1. Electrothinning and Electrodeposition of Metals in Magnetic Fields
2. Effect of a Local Magnetic Field on the Dissolution of Copper and Iron in Nitric Acid Solution
3. Effect of Rapid Cathode Rotation and Magnetic Fields on Crystal Orientation in Electrodeposited Metals
4. The effect of a uniform magnetic field on mass transfer in electrolysis
5. Magnetic Field Effects on the Growth of the Diffusion Layer at Vertical Electrodes during Electrodeposition
6. Abste. Ann. Meet. Jpn. Soc. of Corrosion Engineering