A Long-Term In Vitro Silicon-Based MicroelectrodeNeuron Connection

IEEE Transactions on Biomedical Engineering

Volumn 35, Issue 12, 1988, Pages 1023-1032

  Regehr, Wade G ^a   Pine, Jerome ^a   Rutledge, David B ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIOMEDICAL EQUIPMENT--MICROELECTRODES; CELL CULTURE;

CULTURED NEURONS; HELISOMA B19 NEURONS; MICROELECTRODE-NEURON CONNECTION; NEUROMUSCULAR STIMULATION; SILICON BASED MICROELECTRODES;

BIOMEDICAL ENGINEERING;

SILICON;

CELL CULTURE; MICROELECTRODE; NERVE CELL CULTURE;

CELLS, CULTURED; ELECTROPHYSIOLOGY; EQUIPMENT DESIGN; MICROELECTRODES; NEURONS; SUPPORT, U.S. GOV'T, NON-P.H.S.;

EID: 0024208464     PISSN: 00189294     EISSN: 15582531     Source Type: Journal    
DOI: 10.1109/10.8687     Document Type: Article

References (28)

1. A. Marty and E. Neher, “Tight-seal whole-cell recording,” in Single Channel Recording, B. Sakmann and E. Neher, Eds. New York; Plenum, 1983, pp. 107–121.
2. C. A. Thomas, Jr., P. A. Springer, G. E. Loeb, Y. Berwald-Netter, and L. M. Okun, “A miniature microelectrode array to monitor the bioelectric activity of cultured cells,” Exp. Cell Res., vol. 74, pp. 61–66, 1972.
3. G. W. Gross, A. N. Williams, and J. H. Lucas, “Recording of spontaneous activity with photoetched microelectrode surfaces from spinal cord neurons in culture,” J. Neuroscience Meth., vol. 5, pp. 13–22, 1982.
4. J. Pine, “Recording action potentials from cultured neurons with extracellular microcircuit electrodes,” J. Neuroscience Meth., vol. 2, pp. 19–31, 1980.
5. D. W. Tank, C. S. Cohan, and S. B. Kater, “Cell body capping of array electrodes improves measurements of extracellular voltages in microcultures of invertebrate neurons,” in Proc. IEEE Conf. Synthet. Microstruct., Airlie House, Arlington, VA, 1986.
6. D. A. Israel, W. H. Barry, D. J. Edell, and R. G. Mark, “An array of microelectrodes to stimulate and record from cardiac cells in culture,” Amer. J. Physiol., vol. 247, pp. H669-H674, 1984.
7. W. Stuhmer, W. M. Roberts, and W. Aimers, “The loose patch clamp,” in Single Channel Recording, B. Sakmann and E. Neher, Eds. New York: Plenum, 1983, pp. 123–132.
8. W. Regehr, Unpublished observations.
9. K. E. Peterson, “Silicon as a mechanical material,” Proc. IEEE, vol. 70, no. 5, pp. 420–457, 1982.
10. B. Schwartz and H. Robbins, “Chemical etching of silicon, II. The system HE, HNO3, HC2H3O2,” J. Electrochem. Soc., vol. 107, pp. 108–111, 1959.
11. Sohio Carborundum PDS Planar Diffusion Sources: Tech. Inform., 1986.
12. D. Rupprecht, and J. Stach, “Oxidized boron nitride wafers as an in situ boron dopant for silicon diffusions,” J. Electrochem. Soc., vol. 120, no. 9, pp. 1266–1271, 1973.
13. K. Najafi, K. D. Wise, and T. Mochizuki, “A high-yield IC-com-patible multichannel recording array,” IEEE Trans. Electron. Devices, vol. ED-32, July 1985.
14. R. Glang and L. V. Gregor, “Generation of patterns in thin films,” in Handbook of Thin Film Technology, L. 1. Maissel and R. Glang, Eds. New York; McGraw-Hill, 1970, p. 7–37.
15. W. R. Snow, “PWS 450 COYOTE: A vertical parallel plate plasma reactor for silicon nitride deposition,” Pacific West. Syst. Appl. Note, March 1981.
16. T. Sugano, Applications of Plasma Processes to VLSI Technology. New York; Wiley, 1985.
17. C. M. Melliar-Smith and C. J. Mogab, “Plasma assisted etching techniques for pattern deliniation,” in Thin Film Processes, J. L. Vossen and W. Kern, Eds. New York: Academic, 1978, pp. 497-552.
18. R. M. Finneand, D. L. Klein, “A water-amine-complexing agent system for etching silicon,” J. Electrochem. Soc., vol. 114, pp. 965-970, Sept. 1967.
19. A. Reisman, M. Berkenblit, S. A. Chan, F. B. Kaufman, and D. C. Green, “The controlled etching of silicon in catalyzed ethylenedi-amine-pyrocatechol-water solutions,” J. Electrochem. Soc., vol. 126, no. 8, pp. 1406–1415, 1979.
20. R. C. Gesteland, B. Howland, J. Y. Lettvin, and W. M. Pitts, “Comments on microelectrodes,” Proc. IRE, vol. 47, pp. 1856–1862, 1959.
21. D. A. Robinson, “The electrical properties of metal electrodes,” Proc. IEEE, vol. 56, no. 6, pp. 1065–1071, June 1968.
22. D, S. Campbell, “Mechanical properties of thin films,” in Handbook of Thin Film Technology, L. I. Maissel and R. Glang, Eds. New York: McGraw-Hill, 1970, pp. 12–29.
23. K. E. Peterson and C. R. Guamieri, “Young's modulus measurements of thin films using micromechanics,” J. Appl. Phys., vol. 50, pp. 6761–6766, 1979.
24. Figure provided courtesy of W. R. Snow and V. Dunton of Pacific Western Systems.
25. S. W. Kuffler, J. G. Nicholls, and A. R. Martin, From Neuron to Brain. Sunderland, MA: Sinauer Associates, 1984, p. 173.
26. R. G. Wong, R. D. Hadley, S. B. Kater, and G. Hauser, “Neurite outgrowth in molluscan organ and cell cultures: The role of conditioning factor(s),” J. Neuroscience, vol. 1, p. 1008, 1981.
27. C.-P. Ko, H. Burton, J. I. Johnson, and R. P. Bunge, “Synaptic transmission between rat superior cervical ganglion neurons in dissociated cell cultures,” Brain Res., vol. 117, pp. 461–485, 1976.
28. C. S. Cohan and S. B. Kater, “Suppression of neurite elongation of growth cone dynamics by electrical activity,” Science, vol. 232, pp. 1638–1640, 1986.