New high temperature stable positive photoresists based on hydroxy polyimides and polyamides containing the hexafluoroisopropylidene (6-F) linking group

Technical Papers, Regional Technical Conference - Society of Plastics Engineers

Volumn , Issue , 1988, Pages 429-443

  Khanna, D N ^a   Mueller, W H ^a  

^a Hoechst Celanese Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLUORINE CONTAINING POLYMERS; LITHOGRAPHY; PLASTICS FILMS; POLYAMIDES--SYNTHESIS; POLYIMIDES--SYNTHESIS;

DIMETHYLFORMAMIDE; NOVOLAK RESIN; THIONYL CHLORIDE;

PHOTORESISTS;

EID: 0024174107     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)