0.5 micron CMOS for high performance at 3.3 V

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 1988, Pages 52-55

  Chapman, R A ^a   Wei, C C ^a   Bell, D A ^a   Aur, S ^a   Brown, G A ^a   Haken, R A ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING;

0.5 MICRON CMOS; HOT-CARRIER STRESS; REDUCED SUPPLY VOLTAGE; SHORT-CHANNEL;

SEMICONDUCTOR DEVICES, MOS;

EID: 0024170162     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)