Interface bonding in a diamond/metal matrix composite

Volumn , Issue , 1988, Pages 443-449

  Lin, Zengdong ^a   Queeney, R A ^a  

^a Beijing Research Institute   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER TIN ALLOYS--METALLIC MATRIX COMPOSITES; DIAMONDS; DIFFUSION; MICROSCOPIC EXAMINATION--TRANSMISSION ELECTRON MICROSCOPY; TITANIUM AND ALLOYS;

DIAMOND-METAL COMPOSITES; INTERDIFFUSION; INTERFACE BONDING;

POWDER METALLURGY;

EID: 0024167127     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)