Effects of linelength and bend structure on electromigration lifetime in Al-Cu submicron interconnects.

Volumn , Issue , 1988, Pages 436-445

  Kwok, Thomas ^a   Finnegan, John ^a   Johnson, Donald ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COPPER ALLOYS;

CURRENT CROWDING; ELECTROMIGRATION; LINELENGTH; SUBMICRON INTERCONNECTS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0024142305     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)