Material compatibility in interfacial transient thermal fracture of ceramic-to-metal bonds

Journal of Applied Mechanics, Transactions ASME

Volumn 55, Issue 4, 1988, Pages 767-772

  Kokini, Klod ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING--DISSIMILAR MATERIALS; CERAMIC MATERIALS--BONDING; METALS AND ALLOYS--BONDING; STRAIN; THERMAL EFFECTS;

COMNINOU MODEL; STRAIN ENERGY RELEASE RATES;

COMPOSITE STRUCTURES;

EID: 0024141972     PISSN: 00218936     EISSN: 15289036     Source Type: Journal    
DOI: 10.1115/1.3173720     Document Type: Article

References (14)

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3. Berndt, C. C., and Miller, R. A., 1984, “Failure Analysis of Plasma-Sprayed Thermal Barrier Coatings,” Thin Solid Films, Vol. 119, pp. 173-184.
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5. Charreyron, P. O., Patten, D. O., and Miller, B. J., 1987, “Modeling of Ceramic-to-Metal Brazed Joints,” presented at the 89th American Ceramic Society Annual Meeting, Pittsburgh, PA.
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8. Hartsock, D. L., and McLean, A. F., 1984, “What the Designer with Ceramic Needs,” American Ceramic Society Bulletin, Vol. 63, No. 2, pp. 266-270.
9. Kokini, K., 1987, “Interfacial Cracks in Ceramic-to-Metal Bonds Under Transient Thermal Loads,” Journal of the American Ceramic Society, Vol. 70, No. 12, pp. 855-859.
10. Kokini, K., 1987, “Boundary Effects on the Interfacial Transient Thermal Fracture of Ceramic-to-Metal Bonds,” Advances in Ceramics, in press.
11. Liebert, C. H., and Miller, R. A., 1984, “Ceramic Thermal Barrier Coatings,” I&EC Product Research and Development, pp. 344-349.
12. Martih-Moran, C. J., Barber, J. R., and Comninou, M., 1983, “The Penny-Shaped Interface Crack with Heat Flow, Part I: Perfect Contact,” ASME JOURNAL OF APPLIED MECHANICS, Vol. 50, pp. 19-36.
13. Smelser, R. E., 1979, “Evaluation of Stress Intensity Factors for Bimaterial Bodies Using Numerical Crack Flank Displacement Data,” International Journal of Fracture, Vol. 15, pp. 135-143.
14. Suga, T., and Elssner, G., 1986, “Composite Parameters and Mechanical Compatibility of Material Joints,” private communications.