Membrane probe card technology (the future for higher performance wafer test)

Digest of Papers - International Test Conference

Volumn , Issue , 1988, Pages 601-607

  Leslie, Brian ^a   Matta, Farid ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LOGIC CIRCUITS, EMITTER COUPLED; SEMICONDUCTOR DEVICES;

HIGH-PIN-COUNT DEVICES; MEMBRANE PROBE CARD TECHNOLOGY; SEMICONDUCTOR WAFERS;

INTEGRATED CIRCUITS, VLSI;

EID: 0024125041     PISSN: 07431686     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)