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Volumn , Issue , 1988, Pages 221-224
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Low cost, high-performance package for a multi-chip MMIC module
a a
a
NTT CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
AMPLIFIERS, MICROWAVE;
CERAMIC MATERIALS;
ELECTRONIC CIRCUITS, MICROWAVE;
MICROSTRIP DEVICES;
SEMICONDUCTING GALLIUM ARSENIDE;
CERAMIC PACKAGE;
VOLTAGE STANDING-WAVE RATIO;
INTEGRATED CIRCUITS, MONOLITHIC;
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EID: 0024124598
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (11)
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References (7)
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