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Volumn , Issue , 1988, Pages 261-264
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Design and packaging approach for MMIC insertion in a broadband 4 ×4 microwave switch matrix
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC SWITCHES;
ELECTRONIC CIRCUITS;
ELECTRONICS PACKAGING;
SEMICONDUCTING GALLIUM ARSENIDE;
TRANSISTORS, FIELD EFFECT;
INSERTION LOSS;
MICROWAVE SWITCH MATRIX;
INTEGRATED CIRCUITS, MONOLITHIC;
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EID: 0024124187
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (6)
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References (8)
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