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Volumn 9, Issue 11-12, 1988, Pages 1567-1578
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Low dielectric constant, alumina-compatible, co-fired multilayer substrate
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINA--THERMAL EXPANSION;
CERAMIC PRODUCTS--THERMAL EXPANSION;
ELECTRONICS PACKAGING--MATERIALS;
CO-FIRED MULTILAYER SUBSTRATE;
MULTILAYER CERAMIC;
THERMAL EXPANSION COMPATIBILITY;
CERAMIC MATERIALS;
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EID: 0024113116
PISSN: 01966219
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (62)
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References (0)
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