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J. Iwamura et al, “A high speed and low power CMOS/SOS multiplier-accumulator,” Microelectron. J., vol. 14, no. 6, pp. 49–57, 1983.
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Microelectron. J.
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Iwamura, J.1
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“A CMOS/SOS multiplier,”
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Feb.
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J. Iwamura, K. Suganuma, M. Kimura, and S. Taguchi, “A CMOS/SOS multiplier,” in ISSCC Dig. Tech. Papers, Feb. 1984, pp. 92–93.
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(1984)
ISSCC Dig. Tech. Papers
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Iwamura, J.1
Suganuma, K.2
Kimura, M.3
Taguchi, S.4
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“Synchronization reliability in CMOS technology,”
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Aug.
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S. Flannagan, “Synchronization reliability in CMOS technology,” IEEE J. Solidstate Circuits, vol. SC-20, pp. 880–882, Aug. 1985.
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IEEE J. Solidstate Circuits
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Flannagan, S.1
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0021372077
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“Driving large capacitances in MOS LSI systems,”
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Feb. A Hidden Surface and Shading Processor ‘HSSP’ with a Systolic Architecture TEIJI NISHIZAWA, TAKERU OHGI. HIROSHI KAMIYAMA. KAZUYASU NAGATOMI. AND KIYOSHI MAENOBU Abstract—A skewed systolic array architecture, which consists of 256 pixel processors ‘PP's’ in a chip, performs hidden surface elimination and smooth shading for three-dimensional ‘3-D’ graphics. The chip is based on a ScanLine Z-buffer algorithm. Segment tokens and sweep tokens flow through a unidirectional linear array of PP's, and the resulting video intensity data are output via a common bus. One PP has two 16-bit buffers ‘Z buffer, I buffer’ and a 16-bit arithmetic unit in its data path. Although each PP processes a token in four or five clocks, depending upon the shading mode, the token proceeds at a rate of one PP even clock. Therefore the intensity output rate is kept constant at the video frequency, i.e., 20 Mpixels per second. The chip is fabricated in 1.2-μm twin-rub CMOS technology. It contains 330K transistors on a 11.06X11.05-mm die, and operates with a 20-MHz single phase clock.
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M. Nemes, “Driving large capacitances in MOS LSI systems,” IEEE J. Solidstate Circuits, vol. SC-19, pp. 159–161, Feb. 1984. A Hidden Surface and Shading Processor ‘HSSP’ with a Systolic Architecture TEIJI NISHIZAWA, TAKERU OHGI. HIROSHI KAMIYAMA. KAZUYASU NAGATOMI. AND KIYOSHI MAENOBU Abstract—A skewed systolic array architecture, which consists of 256 pixel processors ‘PP's’ in a chip, performs hidden surface elimination and smooth shading for three-dimensional ‘3-D’ graphics. The chip is based on a ScanLine Z-buffer algorithm. Segment tokens and sweep tokens flow through a unidirectional linear array of PP's, and the resulting video intensity data are output via a common bus. One PP has two 16-bit buffers ‘Z buffer, I buffer’ and a 16-bit arithmetic unit in its data path. Although each PP processes a token in four or five clocks, depending upon the shading mode, the token proceeds at a rate of one PP even clock. Therefore the intensity output rate is kept constant at the video frequency, i.e., 20 Mpixels per second. The chip is fabricated in 1.2-μm twin-rub CMOS technology. It contains 330K transistors on a 11.06X11.05-mm die, and operates with a 20-MHz single phase clock.
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(1984)
IEEE J. Solidstate Circuits
, vol.SC-19
, pp. 159-161
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Nemes, M.1
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