Chemical Etching Properties of Highly Thermal Conductive AIN Ceramics for Electroless Ni-P Metallization

Journal of the Electrochemical Society

Volumn 135, Issue 10, 1988, Pages 2578-2581

  Osaka, Tetsuya ^a   Asada, Toshiaki ^a   Nakajima, Eiji ^a   Koiwa, Ichiro ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS PLATING--NICKEL COMPOUNDS; FILMS--ADHESION; SUBSTRATES;

ADHESION STRENGTH; ALUMINUM NITRIDE; INTEGRATION DENSITY; YTTRIUM OXIDE;

CERAMIC MATERIALS;

EID: 0024090921     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2095384     Document Type: Article

References (8)

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