Design Rules for Microstrip Capacitance

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 11, Issue 3, 1988, Pages 253-259

  Bogatin, Eric ^a  

^a Raychem Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; ELECTRONICS PACKAGING;

CHARACTERISTIC IMPEDANCE; INTERCONNECT CAPACITANCE; MICROSTRIP CAPACITANCE; MICROSTRIP GEOMETRY;

MICROSTRIP DEVICES;

EID: 0024073149     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.16649     Document Type: Article

References (17)

1. Motorola Inc., Motorola Microprocessors Data Manual, ser. B, 1981, p. 4–56.
2. Motorola Inc., Motorola Microprocessors Data Manual, ser. B, 1981, p. 4–58.
3. F. J. Belcourt and T. A. Lane, “Electrical CAD analysis for multilayer package design,” Int. J. Hybrid Microelectron., vol. 10, no. 1, 1st Quarter, 1987.
4. E. W. Anderson, Electric Transmission Line Fundamentals. Englewood Cliffs, NJ: Reston. 1985.
5. E. L. Bogatin, “Beyond printed wiring board densities,” in Proc. Nepcon East (Boston, MA, June 1987).
6. M. A. R. Gunston, Microwave Transmission Line Impedance Data. New York, NY: Nostrand Reinhold, 1971.
7. K. C. Gupta, R. Garg, and R. Chadha, Computer Aided Design of Microwave Circuits. Norwood, MA: Artech House, 1981.
8. T. C. Edwards, Foundations for Microstrip Circuit Design. New York, NY: Wiley, 1981.
9. E. M. Purcell, Electricity and Magnetism. New York, NY: McGraw-Hill, 1965.
10. H. R. Kaupp, “Characteristics of microstrip transmission lines,” IEEE Trans. Electron. Comput., vol. EC-16, no. 2, p. 185, Apr. 1967.
11. M. V. Schneider, “Microstrip lines for microwave integrated circuits,” Bell Syst. Tech. J., vol. 48, no. 5, p. 1421, May 1969.
12. A. Kumar, D. Kumar, H. C. Gupta, K. N. Tripathi, and P. C. Mathur, “A method for the calculation of the characteristic impedance of microstrips,” Int. J. Electron., vol. 40, no. 1, p. 45, 1976.
13. H. A. Wheeler, “Transmission line properties of a strip on a dielectric sheet on a plane,” IEEE Trans. Microwave Theory Tech., vol. MTT-25, no. 8, p. 631, Aug. 1977.
14. T. Sakurai and K. Tamaru, “Simple formulas for two and three dimensional capacitances,” IEEE Trans. Electron. Devices, vol. ED- 30, no. 2, p. 183, Feb. 1983.
15. S. Y. Poh, W. C. Chew, and J. A. Kong, “Approximate formulas for line capacitance and characteristic impedance of microstrip line,” IEEE Trans. Microwave Theory Tech., vol. MTT-29, p. 135, Feb. 1981; and the erratum in IEEE Trans. Microwave Theory Tech., vol. MTT-29, no. 10, p. 1119, Oct. 1981.
16. Rogers Corp. Microwave Material Division, Chandler, Az., Data Sheet #RT 01.5880.
17. M. Caulton, J. J. Hughes, and H. Sobol, “Measurements on the properties of microstrip transmission lines for microwave integrated circuits” RCA Rev., vol. 27, no. 3, p. 377, Sept. 1966.