Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux

Journal of Heat Transfer

Volumn 110, Issue 3, 1988, Pages 728-734

  Park, K A ^a   Bergles, A E ^b  

^a Korea Research Institute of Standards and Science   (South Korea)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Boiling; Electronic equipment; Thermal packaging

Indexed keywords

ELECTRONIC EQUIPMENT - HEAT TRANSFER; MICROELECTRONICS;

BOILING CURVES; CRITICAL HEAT FLUX; SIMULATED MICROELECTRONIC CHIPS;

HEAT TRANSFER;

EID: 0024064268     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.3250552     Document Type: Article

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