On the decohesion of residually stressed thin films

Acta Metallurgica

Volumn 36, Issue 8, 1988, Pages 2019-2028

  Drory, M D ^a   Thouless, M D ^a   Evans, A G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; FILMS; GLASS; MATHEMATICAL TECHNIQUES - NUMERICAL METHODS; SILICA;

RESIDUALLY STRESSED THIN FILMS; THIN FILMS DECOHESION;

LAMINATED PRODUCTS;

EID: 0024056874     PISSN: 00016160     EISSN: None     Source Type: Journal    
DOI: 10.1016/0001-6160(88)90303-3     Document Type: Article

References (7)

1. Decohesion of Thin Films From Ceramic Substrates
2. Low Temperature Oxidation and Spalling of Electrodeposited and Vapour-Deposited Copper