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Volumn 7, Issue 5, 1988, Pages 549-556

CAPCAL-A 3-D Capacitance Solver for Support of CAD Systems

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC FIELDS - MATHEMATICAL MODELS; INTEGRATED CIRCUITS, VLSI - COMPUTER AIDED DESIGN; MATHEMATICAL TECHNIQUES - FINITE DIFFERENCE METHOD;

EID: 0024011516     PISSN: 02780070     EISSN: 19374151     Source Type: Journal    
DOI: 10.1109/43.3192     Document Type: Article
Times cited : (27)

References (12)
  • 1
    • 0008731123 scopus 로고
    • Etched sheets as microwave components
    • June
    • R.M. Barrett, “Etched sheets as microwave components,” Electronics, vol. 25, pp. 114–118, June 1952.
    • (1952) Electronics , vol.25 , pp. 114-118
    • Barrett, R.M.1
  • 2
    • 0002904097 scopus 로고
    • Characteristic impedance of shielded strip transmission line
    • July
    • S.B. Cohn, “Characteristic impedance of shielded strip transmission line,” IRE Trans. Microwave Theory Tech., vol. MTT-2, no. 2, pp. 52–57, July 1954.
    • (1954) IRE Trans. Microwave Theory Tech. , vol.2 MTT , Issue.2 , pp. 52-57
    • Cohn, S.B.1
  • 3
    • 84938003701 scopus 로고
    • Transmission line properties of parallel strips separated by a dielectric sheet
    • Mar.
    • H.A. Wheeler, “Transmission line properties of parallel strips separated by a dielectric sheet,” IEEE Trans. Microwave Theory Tech., vol. MTT-13, pp. 172–185, Mar. 1965.
    • (1965) IEEE Trans. Microwave Theory Tech. , vol.13 MTT , pp. 172-185
    • Wheeler, H.A.1
  • 5
    • 0021640088 scopus 로고
    • Wiring capacitance simulation in two and three dimensions
    • presented at, San Diego, CA, Sept. 10–12
    • M. Fukuma and R.H. Uebbing, “Wiring capacitance simulation in two and three dimensions,” presented at 1984 Symp. VLSI Technol., San Diego, CA, Sept. 10–12, 1984.
    • (1984) 1984 Symp. VLSI Technol.
    • Fukuma, M.1    Uebbing, R.H.2
  • 6
    • 0022059944 scopus 로고
    • VLSI wiring capacitance
    • May
    • P.E. Cotrell and E.M. Buturla, “VLSI wiring capacitance,” IBM J. Res. Develop., vol. 29, no. 3, pp. 277–288, May 1985.
    • (1985) IBM J. Res. Develop. , vol.29 , Issue.3 , pp. 277-288
    • Cotrell, P.E.1    Buturla, E.M.2
  • 7
    • 0015161083 scopus 로고
    • Properties of microstripline on Si-Si02 system
    • H. Hasegawa, “Properties of microstripline on Si-Si02 system,” IEEE Trans. Microwave Theory Tech., vol. MTT-19, pp. 869–881, 1971.
    • (1971) IEEE Trans. Microwave Theory Tech. , vol.19 MTT , pp. 869-881
    • Hasegawa, H.1
  • 9
    • 0022679217 scopus 로고
    • Combined process and device modeling
    • H. Klose and A. Seidl, “Combined process and device modeling,” Solid-State Electron., vol. 29, no. 3, 1986, pp. 371–375.
    • (1986) Solid-State Electron. , vol.29 , Issue.3 , pp. 371-375
    • Klose, H.1    Seidl, A.2
  • 11
    • 0020180711 scopus 로고
    • A multigrid method for the solution of the diffusion equation in VLSI process modeling
    • A. Seidl, “A multigrid method for the solution of the diffusion equation in VLSI process modeling,” IEEE Trans. Electron Devices, vol. ED-30, p. 999, 1983.
    • (1983) IEEE Trans. Electron Devices , vol.30 ED , pp. 999
    • Seidl, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.