-
1
-
-
0008731123
-
Etched sheets as microwave components
-
June
-
R.M. Barrett, “Etched sheets as microwave components,” Electronics, vol. 25, pp. 114–118, June 1952.
-
(1952)
Electronics
, vol.25
, pp. 114-118
-
-
Barrett, R.M.1
-
2
-
-
0002904097
-
Characteristic impedance of shielded strip transmission line
-
July
-
S.B. Cohn, “Characteristic impedance of shielded strip transmission line,” IRE Trans. Microwave Theory Tech., vol. MTT-2, no. 2, pp. 52–57, July 1954.
-
(1954)
IRE Trans. Microwave Theory Tech.
, vol.2 MTT
, Issue.2
, pp. 52-57
-
-
Cohn, S.B.1
-
3
-
-
84938003701
-
Transmission line properties of parallel strips separated by a dielectric sheet
-
Mar.
-
H.A. Wheeler, “Transmission line properties of parallel strips separated by a dielectric sheet,” IEEE Trans. Microwave Theory Tech., vol. MTT-13, pp. 172–185, Mar. 1965.
-
(1965)
IEEE Trans. Microwave Theory Tech.
, vol.13 MTT
, pp. 172-185
-
-
Wheeler, H.A.1
-
4
-
-
0021649095
-
Capacitance computation for VLSI structures
-
(Swansea, UK), July
-
F. Straker and S. Selberherr, “Capacitance computation for VLSI structures,” in Proc. Int. Conf. Simulation of Semiconductor Devices and Processes (Swansea, UK), July 1984, pp. 39–55.
-
(1984)
Proc. Int. Conf. Simulation of Semiconductor Devices and Processes
, pp. 39-55
-
-
Straker, F.1
Selberherr, S.2
-
5
-
-
0021640088
-
Wiring capacitance simulation in two and three dimensions
-
presented at, San Diego, CA, Sept. 10–12
-
M. Fukuma and R.H. Uebbing, “Wiring capacitance simulation in two and three dimensions,” presented at 1984 Symp. VLSI Technol., San Diego, CA, Sept. 10–12, 1984.
-
(1984)
1984 Symp. VLSI Technol.
-
-
Fukuma, M.1
Uebbing, R.H.2
-
6
-
-
0022059944
-
VLSI wiring capacitance
-
May
-
P.E. Cotrell and E.M. Buturla, “VLSI wiring capacitance,” IBM J. Res. Develop., vol. 29, no. 3, pp. 277–288, May 1985.
-
(1985)
IBM J. Res. Develop.
, vol.29
, Issue.3
, pp. 277-288
-
-
Cotrell, P.E.1
Buturla, E.M.2
-
7
-
-
0015161083
-
Properties of microstripline on Si-Si02 system
-
H. Hasegawa, “Properties of microstripline on Si-Si02 system,” IEEE Trans. Microwave Theory Tech., vol. MTT-19, pp. 869–881, 1971.
-
(1971)
IEEE Trans. Microwave Theory Tech.
, vol.19 MTT
, pp. 869-881
-
-
Hasegawa, H.1
-
8
-
-
0020180767
-
Semiconductor device simulation
-
W. Fichtner, D.J. Rose, and R.E. Bank, “Semiconductor device simulation,” IEEE Trans. Electron Devices, vol. ED-30, pp. 10181030.
-
IEEE Trans. Electron Devices
, vol.30 ED
, pp. 10181030
-
-
Fichtner, W.1
Rose, D.J.2
Bank, R.E.3
-
9
-
-
0022679217
-
Combined process and device modeling
-
H. Klose and A. Seidl, “Combined process and device modeling,” Solid-State Electron., vol. 29, no. 3, 1986, pp. 371–375.
-
(1986)
Solid-State Electron.
, vol.29
, Issue.3
, pp. 371-375
-
-
Klose, H.1
Seidl, A.2
-
11
-
-
0020180711
-
A multigrid method for the solution of the diffusion equation in VLSI process modeling
-
A. Seidl, “A multigrid method for the solution of the diffusion equation in VLSI process modeling,” IEEE Trans. Electron Devices, vol. ED-30, p. 999, 1983.
-
(1983)
IEEE Trans. Electron Devices
, vol.30 ED
, pp. 999
-
-
Seidl, A.1
|