DISTORTION IN THERMAL FIELD AROUND INSERTED THERMOCOUPLES IN EXPERIMENTAL INTERFACIAL STUDIES - PART II. EFFECT OF THE HEAT FLOW THROUGH THE THERMOCOUPLE.

Journal of engineering for industry

Volumn 110, Issue 1, 1988, Pages 7-14

  Attia, M H ^a   Kops, L ^a  

^a ONTARIO HYDRO TECHNOLOGIES   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TRANSFER - COMPUTER SIMULATION; TEMPERATURE DISTRIBUTION - COMPUTER AIDED ANALYSIS;

COMPUTER-AIDED SCANNING; ELECTRICAL ANALOG TECHNIQUE; THERMOCOUPLE WIRES; THERMOMETRIC DESIGN CONSIDERATIONS;

THERMOCOUPLES;

EID: 0023960822     PISSN: 00220817     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.3187847     Document Type: Article

References (35)