CURE MONITORING USING DIELECTRIC AND DYNAMIC MECHANICAL ANALYSIS.

Annual Technical Conference - Society of Plastics Engineers

Volumn , Issue , 1987, Pages 1039-1042

  Gotro, Jeffrey ^a   Yandrasits, Michael ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMICS; EPOXY RESINS - MECHANICAL PROPERTIES; POLYMERS - DIELECTRIC PROPERTIES; RHEOMETERS; SENSORS;

CURE MONITORING; DIELECTRIC LOSS FACTOR; DYNAMIC MECHANICAL ANALYSIS;

THERMOSETS;

EID: 0023579398     PISSN: 07334192     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)