A New Metallization Technology for Advanced Interconnects on Substrates

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 10, Issue 4, 1987, Pages 571-576

  Nguyen, Pascaline H ^a   Bachner, Frank J ^a  

^a BASF SE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTORS - THIN FILMS; INTEGRATED CIRCUITS - ELECTRIC WIRING; RESISTORS - FILMS; SEMICONDUCTOR MATERIALS - THERMAL EFFECTS;

ADVANCED INTERCONNECTS; METALLO-ORGANIC DEPOSITION (MOD); TEMPERATURE COEFFICIENT RESISTANCE (TCR);

SUBSTRATES;

EID: 0023558469     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1987.1134771     Document Type: Article

References (7)

1. J. Agnew, Thick Film Technology, Fundamentals and Applications in Microelectronics. Rochelle Park, NJ: Hayden Book Co., 1973.
2. Maissel and Glang, Handbook of Thin Film Technology. New York: McGraw-Hill, 1970.
3. J. H. Hardwood, Industrial Applications of Organa Metallic Compounds. New York: Reinhold, 1963.
4. R. W. West “Metallo organic material for improved thick film reliability,” prepared for Naval Avionics Center, Contract N00163-79-C-0352, Final Rep., Sept. 18, 1976–Sept. 7, 1980.
5. H. Zeiss, Organo Metallic Chemistry. New York: Reinhold, 1960.
6. P. H. Nguyen, C. E. Faletta, and F. R. Russo, “Multilayering with polyimide dielectric and metallo-organic conductors,” in Proc. 1985 Int. Symp. Microelectronics, 1985, Anaheim, CA, pp. 258–261.
7. P. H. Nguyen and F. R. Russo, “New polyimide system for multilayering,” in Proc. 1986 Int. Symp. Microelectronics, Atlanta, GA, 1986, pp. 702–706.