MECHANISM OF THE ACCELERATED DICY CURE OF EPOXY RESIN SYSTEMS FOR ELECTRICAL APPLICATIONS.

SAMPE Journal

Volumn 23, Issue 6, 1987, Pages 16-20

  Jackson, R J ^a   Pigneri, A M ^a   Galgoci, E C ^a  

^a SHELL GLOBAL SOLUTIONS INTERNATIONAL B V   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL REACTIONS - REACTION KINETICS; PLASTICS LAMINATES - INDUSTRIAL APPLICATIONS; PRINTED CIRCUITS - PLASTICS APPLICATIONS;

ACCELERATED DICY CURE; DICYANDIAMIDE (DICY)/EPOXY RESIN; GLASS TRANSITION TEMPERATURE; PRINTED CIRCUIT BOARDS;

EPOXY RESINS;

EID: 0023450866     PISSN: 00911062     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)