A Study on Formation of Alloyed Layer of Low Melting Temperature on Bonding Surface of IN738LC with Boron Pack Cementation

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

Volumn 5, Issue 3, 1987, Pages 370-373

  Kate, Mitsuo ^a   Funamoto, Takao ^a   Wachi, Hiroshi ^a   Matsuzaka, Takeshi ^a   Shida, Tomohiko ^a   Kokura, Satoshi ^a  

^a HITACHI LTD   (Japan)

Author keywords

Diffusion Bond ng; Pack Cementation; Super Alloy

Indexed keywords

BORON - BONDING; NICKEL AND ALLOYS - DIFFUSION; NICKEL METALLOGRAPHY - MICROSTRUCTURES; WELDING - COLD METHOD;

ALLOYED LAYER FORMATION; BORON COATED LAYER DEGASSING; BORON PACK CEMENTATION; DIFFUSION WELDING; VACUUM HEAT TREATMENT;

SUPERALLOYS;

EID: 0023398582     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.5.370     Document Type: Article

References (3)

1. D. Duvall, W. Owczarski, D., Paulonis: TLP Bonding: a new melted for Joining Heat Resistance alloys, Weld. J 53 (1974) 203–214
2. G. Hoppin, T. Bery: Activated Diffusion Bonding: Weld. J 49 (1970) 505s-509s
3. P. E. Doherty, D. R. Harvaden: New Forms of Filler Materials for Diffusion Brazing: Weld.J 56(1977) 37