Bonding silicon wafer to silicon nitride with spin-on glass as adhesive

Electronics Letters

Volumn 23, Issue 7, 1987, Pages 314-315

  Yamada, A ^a   Kawasaki, T ^a   Kawashima, M ^a  

^a SUMITOMO METAL MINING CO LTD   (Japan)

Author keywords

Semiconductor devices and materials; Wafer bonding

Indexed keywords

GLASS; SILICON NITRIDE;

RADIAL STRIATIONS; SILICON WAFER; SOG FILMS; SPIN-ON-GLASS; WAFER BONDING;

SEMICONDUCTING SILICON;

EID: 0023314742     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19870233     Document Type: Article

References (6)

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2. Lasky, J. B., Stiffler, S. R., White, F. R., and Abernathey, J. R.: Washington, DC, 1985, Technical digest, pp. 684-687
3. Yamada, A., Kawasaki, T., and Kawashima, M.: Electron. Lett., 1987, 23, pp. 39-40
4. Lu, D., and Wortman, J. J.: Mater. Lett., 1986, 4, pp. 461-464
5. Ohashi, H., Ohura, J., Tsukakoshi, T., and Simbo, M.: IEEE international electron device meeting, Los Angeles, CA, 1986, Technical digest, pp. 210-213
6. Butherus, A. D., Hou, T. W., Mogab, C. J., and Schonhorn, H.: J. Vac. Sci. & Technol. B, 1985, 3, pp. 1352-1356