Thermal Analysis of Electromigration Test Structures

IEEE Transactions on Electron Devices

Volumn 34, Issue 3, 1987, Pages 664-672

  Schafft, Harry A ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY - TESTING; INTEGRATED CIRCUITS, VLSI - TRANSPORT PROPERTIES; METALLIZING - STRESSES;

ELECTROMIGRATION TEST STRUCTURES; HIGH-CURRENT DENSITY STRESS; MEAN METALLIZATION-STRESS TEMPERATURE; THERMAL CONDUCTIVITY;

RESISTORS;

EID: 0023312194     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/T-ED.1987.22978     Document Type: Article

References (15)

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