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Volumn , Issue , 1987, Pages 456-462
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EFFECTS OF GRAIN GROWTH AND GRAIN STRUCTURE ON ELECTROMIGRATION LIFETIME IN AL-CU SUBMICRON INTERCONNECTS.
a
a
IBM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM AND ALLOYS;
HEAT TREATMENT - ANNEALING;
ALUMINUM-COPPER SUBMICRON INTERCONNECTS;
ELECTROMIGRATION LIFETIME;
GRAIN GROWTH;
GRAIN STRUCTURE;
INTEGRATED CIRCUITS, VLSI;
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EID: 0023230764
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (18)
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References (13)
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