Future Trends in Wafer Scale Integration

Proceedings of the IEEE

Volumn 74, Issue 12, 1986, Pages 1741-1752

  Carlson, Richard O ^a   Neugebauer, Constantine A ^a  

^a GENERAL ELECTRIC COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

WAFER-SCALE INTEGRATION (WSI);

ELECTRONICS PACKAGING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0022913749     PISSN: 00189219     EISSN: 15582256     Source Type: Journal    
DOI: 10.1109/PROC.1986.13689     Document Type: Article

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