HIGHLY RELIABLE PURE Al METALLIZATION WITH LOW CONTACT RESISTANCE UTILIZING OXYGEN-STUFFED TiN BARRIER LAYER.

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1986, Pages 55-56

  Iwabuchi, S ^a   Shima, S ^a   Maeda, T ^a   Moriya, T ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS; METALLURGY;

CONTACT METALLURGY;

INTEGRATED CIRCUITS, VLSI;

EID: 0022861809     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)