SCOPUS 정보 검색 플랫폼

Volumn 17, Issue 6, 1986, Pages 1051-1055

Thermal transient stresses due to rapid cooling in a thermally and elastically orthotropic medium

Author keywords

[No Author keywords available]

Indexed keywords

STRESSES - ANALYSIS;

RESIDUAL STRESS; THERMAL STRESSES; THERMAL TRANSIENT STRESSES;

METALS AND ALLOYS;

EID: 0022736728 PISSN: 03602133 EISSN: 15431940 Source Type: Journal
DOI: 10.1007/BF02661271 Document Type: Article

Times cited : (6)

References (5)

1
- 0016943168
- On the Hygro-thermal Response of Laminated Composite Systems
- (1976) J. Comp. Mat. , vol.10 , pp. 129
- Pipes, R.B.¹ Vinson, J.R.² Chou, T.W.³

2
- 0003742430
- Tech- nomic Publishing Co., Inc., Lancaster, PA
- (1980) Introduction to Composite Materials
- Tsai, S.W.¹ Hahn, H.T.²

4
- 0022128709
- Transient Thermal Stress Analysis of a Rectangular Orthotropic Slab
- (1985) J. Comp. Mat. , vol.19 , pp. 424-42
- Wang, H.S.¹ Chou, T.W.²

5
- 84934665621
- H.S. Wang, T. W. Chou, and F.A. Kulacki: “Transient Two-Dimensional Temperature and Thermal Stress Field Analysis of Thermally and Elastically Orthotropic Slab,” Proceedings of the 21st Annual Meeting of SES, Blacksburg, VA, October 15–17, 1984.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.