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Volumn 73, Issue 5, 1986, Pages 130-134
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HIGH-STRENGTH, COMPOSITE COPPER-NICKEL ELECTRODEPOSITS.
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
FILMS - METALLIC;
METAL FOIL - MECHANICAL PROPERTIES;
COMPOSITE THIN METAL FOILS;
DIFFUSION CONTROL;
MASS TRANSPORT CONTROL;
MODULATING DEPOSITION POTENTIAL;
SYNCHRONOUS MODULATION;
COPPER NICKEL ALLOYS;
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EID: 0022715566
PISSN: 03603164
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (34)
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References (8)
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