ELECTROMIGRATION AND THE CURRENT DENSITY DEPENDENCE.

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1985, Pages 93-99

  Schafft, Harry A ^a   Grant, Tammy C ^a   Saxena, A N ^a   Kao, Chi Yi ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM AND ALLOYS; METALLIZING; STRESSES;

CURRENT DENSITY; ELECTROMIGRATION;

INTEGRATED CIRCUITS;

EID: 0022207691     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)