STRESS INDUCED VOIDS IN ALUMINUM INTERCONNECTS DURING IC PROCESSING.

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1985, Pages 126-137

  Yue, J T ^a   Funsten, W P ^a   Taylor, R V ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM AND ALLOYS; ELECTRON BEAMS; METALLIZING;

ELECTROMIGRATION; METAL VOIDS;

INTEGRATED CIRCUITS;

EID: 0022199371     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/irps.1985.362087     Document Type: Conference Paper

References (12)